high-density assembly
英 [haɪ ˈdensəti əˈsembli]
美 [haɪ ˈdensəti əˈsembli]
高密度装配（把普通电阻，电容和晶体管等元件，根据最佳方案装配而成的微型结构）
双语例句
- 3D-MCM is an effective method for realizing high-density assembly.
三维多芯片组件（3D-MCM）是实现高密度组装的有效手段。 - During high-density electronic assembly development, BGA is used in PCB assembly widely which area is more and more large and solder balls are increased continuously.
随着高密度电子组装的发展，BGA的面积越来越大，引脚数不断增加，广泛地应用到PCB的组装中，从而对电子组装工艺提出了更高的要求，特别是对于无铅BGA的返修。